勛圖tv 繚 ENGINEERING GUIDE
PCB Laminate Loss Classification: Compare Measured Data
PCB laminate loss classifications such as low loss or very low loss are useful screening language, but the labels are not a universal measurement scale shared by every supplier. A material comparison needs the actual Df, Dk, test conditions, construction and copper information. The completed channel then needs its own loss model or measurement.
This page explains how to compare the evidence behind a label. The worksheet illustrates dielectric-only attenuation for a homogeneous low-loss TEM path. It deliberately excludes conductor loss and discontinuities, so its result must not be presented as complete PCB insertion loss.

Ask what the category is based on
Record the supplier's category wording and the document where it is defined. Determine whether the label describes a resin system, laminate construction or intended application. Two suppliers can use similar language while characterizing their products differently.
Do not invent a single Df threshold for each marketing category unless a specific cited classification actually defines it for the required context. A clear comparison can retain the original category while placing measured or modeled data beside it. The data and conditions should drive the engineering decision.
Loss comparison layers
| Record | Meaning | Avoid this shortcut |
|---|---|---|
| Category label | Supplier-defined screening language | No universal threshold assumed |
| Dielectric model | Df, Dk, frequency and length | Conductor effects excluded |
| Complete channel | Matched geometry and transitions | Not guaranteed by Df alone |
Preserve frequency and test method
Loss tangent is frequency- and condition-dependent. The test method and specimen construction also affect how a reported value should be used. Comparing the smallest number in one document with a value measured differently in another can create a misleading ranking.
Use the datasheet reading guide to capture value, unit, method, frequency and conditioning. Mark unmatched comparisons as open. Request appropriate data rather than silently converting a process-control number into the design input for a different field model.
| Review item | What to establish |
|---|---|
| Label | Supplier category wording and its own definition. |
| Data | Frequency, method, construction and typical or guaranteed basis. |
| Channel | Copper and discontinuities remain outside dielectric-only loss. |
| Limit | No category threshold, data-rate guarantee or live price is inferred. |
Separate dielectric loss from the rest of the channel
The complete routing path includes conductor effects as well as dielectric behavior. Copper roughness, geometry, transitions, connectors and other discontinuities can contribute. A material's Df alone does not describe those mechanisms.
The FR-4 permittivity page explains another material input and its modeling boundary. Keep geometry and reference planes consistent when evaluating candidates. A lower dielectric loss tangent can be useful, but the actual channel benefit must be assessed in the intended construction.

Homogeneous TEM dielectric loss illustration
Homogeneous TEM dielectric loss illustration
Use the current inputs and keep the assumptions
Start with the example only to inspect the units and the calculation boundary. Replace every assumption with a value tied to your own document or measurement. An empty numeric field is not zero. The review-reference field is a local label; avoid entering customer names, confidential part numbers or other private information into a public worksheet.
After calculating, read the notes alongside the numerical result. Changing any input invalidates the displayed result and disables its download until you calculate again. For a comparison, keep the units, geometry, material condition and measurement boundary consistent. A long decimal result does not imply equally precise input data. The downloadable record stays on your device and can be attached manually to an inquiry. It is not automatically transferred into the Contact form.
If an input is unknown, identify the person or document needed to resolve it. Do not fill a gap with a favorable generic value simply to obtain a result. You can request a material or fabrication review without using the tool. The arithmetic illustrates a relationship; it does not accept a construction, certify a material, establish current pricing or replace a supplier process specification.
| Input | What to establish before using it |
|---|---|
| Review reference | Nonconfidential revision label. |
| Frequency 繚 GHz | Single frequency; use Df/Dk for this frequency and method. |
| Relative permittivity | Homogeneous bulk permittivity, not an inferred microstrip effective value. |
| Loss tangent Df | Small-loss approximation; the model accepts less than 0.1. |
| Uniform path length 繚 mm | No connector, via or conductor-loss contribution. |
Understand the tool's approximation
For a homogeneous low-loss TEM medium with relative permeability one, dielectric attenuation can be approximated from frequency, relative permittivity and loss tangent. The worksheet converts that attenuation to decibels over the entered length. It is a teaching calculation with explicit assumptions.
The model does not solve microstrip field distribution, dispersive behavior or copper loss. It also does not assign a supplier category. Use it to understand sensitivity to frequency, length and Df, then use a suitable complete channel model or measurement for the design decision.
Worked example: a dielectric-only contribution
At an illustrative 10 GHz, relative permittivity of four, Df of 0.01 and a 100 mm homogeneous path, the approximation gives about 1.82 dB of dielectric-only loss. These are assumed inputs, not a certified grade or measured board result.
Adding copper and discontinuities generally changes the complete channel result. Therefore the example cannot be used to promise a data rate or determine compliance with an interface budget. Its purpose is to make the limited contribution visible rather than hide it behind a broad low-loss label.
Compare constructions at a common channel boundary
Define the frequency or range, length, trace geometry, copper and reference planes for each candidate. If a material change requires a geometry change to preserve impedance, include that change in the analysis. Do not claim a controlled comparison while holding only the material name constant.
The communication-material guide turns these inputs into a channel allocation discussion. The FR-4 versus low-loss comparison adds a matched commercial decision. Both keep total routing behavior separate from an isolated dielectric-property calculation.
Keep qualification and price out of the label
A loss category does not establish manufacturability, reliability, availability or current cost. Those questions need the exact grade, construction, quantity and evidence. A material that is electrically attractive may still require different processing or qualification work.
Record the supplier's proposed stackup and any exceptions before release. Compare quotation scope consistently, including required tests and documentation. Do not assign a percentage price premium from a generic label or assume that a more expensive material resolves an unrelated routing or connector problem.
Prepare a data-based selection inquiry
Send the channel definition, relevant frequency range, proposed stackup, copper information and source of the material data. Identify whether the question is a category comparison, an alternative grade or a specific loss-budget concern.
The local dielectric-loss report can explain an assumption, but it is not a measured channel or an accepted design. Ask for construction-specific information and review of the actual requirements. That turns a vague request for low-loss material into an engineering task that can support a useful quotation.
Keep material selection tied to the complete channel
State the channel reference planes, frequency range, routing length, copper construction, transitions and interface assumptions together. A laminate loss-tangent value is one input to that system. It is not a complete insertion-loss measurement or a guarantee that a data rate will work.
Use comparable measurement or modeling conditions when screening alternatives. Material changes can require geometry changes to preserve impedance, and copper roughness can alter the result independently of the resin system. Keep the proposed stackup and the channel analysis synchronized through fabrication review.
For procurement, identify the properties that are fixed and the alternatives that can be evaluated. Request evidence at the relevant construction and frequency rather than a broad low-loss label. Compare total delivered scope and validation effort alongside material price. A shorter or better-routed channel may change the tradeoff more than replacing a material name alone.
Standards, source context and limits
Use the edition, amendment and material-document revision named in the purchase agreement. A standards title, marketing label or supplier product family does not establish that a particular lot meets a requirement. Public summaries are useful for scope; the controlled specification and applicable test method govern acceptance.
The examples on this page are illustrative engineering scenarios. They are not 勛圖tv production records or guaranteed material values. Source links identify the organizations responsible for the referenced information. Confirm applicability to the exact grade, construction and test condition before carrying a number into a drawing or qualification report.
For fabrication scope and the agreed construction requirements, see PCB manufacturing.