Description
Advanced Dual-Core System-on-Chip for High-Performance Applications
The XCZU7CG-1FBVB900I is a cutting-edge System-on-Chip (SoC) from Xilinx’s Zynq UltraScale+ MPSoC family, offering exceptional processing capabilities for industrial automation, sensor fusion, and other performance-critical applications. This powerful component combines programmable logic with a dual-core application processor system, delivering maximum flexibility and integration for your most demanding designs.
1. Product Specifications
Key Features
- Device Family: Zynq UltraScale+ MPSoC (CG variant)
- System Logic Cells: 504,000
- Processing System: Dual-core ARM Cortex-A53 processor
- Real-time Processing: ARM Cortex-R5 real-time processor
- Manufacturing Technology: 20nm
- Operating Voltage: 0.85V
- Package Type: 900-Pin FCBGA (FBVB package code)
- Speed Grade: -1 (Standard performance)
- Temperature Grade: Industrial (I) for reliable operation in harsh environments
- Programmable Logic: Optimized FPGA fabric for hardware acceleration
Technical Specifications
- CLB Flip-Flops: 460,800
- On-Chip Memory: Enhanced memory architecture with distributed RAM
- Processing Performance: High-performance dual-core processing for industrial applications
- Power Efficiency: Low static and dynamic power consumption with configurable VCCINT voltage
- I/O Capabilities: Extensive I/O options for various interface standards
- Security Features: Integrated security features including AES/SHA engine
Applications
- Industrial Motor Control: Precise control algorithms with real-time processing
- Sensor Fusion: Combining multiple sensor inputs for enhanced system intelligence
- Industrial Automation: High-reliability control systems
- Edge Computing: Distributed intelligence and processing
- Communication Systems: Protocol conversion and interface management
- Embedded Vision: Machine vision and image processing applications
2. Price Information
The XCZU7CG-1FBVB900I is available through authorized distributors including Mouser Electronics, Arrow Electronics, and Avnet. Current pricing varies based on quantity, with price breaks available for volume purchases. For the most competitive pricing and real-time availability:
- Request a customized volume quote from authorized distributors
- Check real-time price monitoring services from FPGAkey
- Contact Xilinx (AMD) representatives for large volume requirements
- Expect pricing to vary based on market conditions and supply chain factors
Note: This component is typically classified as a Non-Cancellable and Non-Returnable (NCNR) item due to its specialized nature. Please verify terms with your distributor before placing an order.
3. Documents & Media
Technical Documentation
- Complete Datasheet: Available in PDF format from Xilinx/AMD
- UltraScale Architecture Overview: Comprehensive product architecture data sheet
- Package Pinout Files: Available in ASCII (TXT) and CSV formats per UG1075
- Reference Design Guides: Application-specific implementation guidelines
- Vivado Design Suite Documentation: Detailed development environment guides
Development Resources
- Vivado Design Suite: Primary design environment for Xilinx FPGAs and SoCs
- Software Development Kits: Tools for application development on the processing system
- Reference Designs: Jump-start your development with proven implementations
- Application Notes: Detailed implementation guidance for specific applications
- Technical Support Forums: Community-based support for troubleshooting
4. Related Resources
Development Tools
- Vivado Design Suite: Comprehensive design environment for hardware development
- Vitis Unified Software Platform: Software development toolkit for Zynq applications
- Development Boards: Compatible evaluation platforms from Xilinx and partners
- IP Cores: Accelerate development with pre-verified intellectual property blocks
- Design Services: Third-party design services for complex implementations
Compatible Components
- Memory Devices: DDR4, LPDDR4, and other compatible memory solutions
- Interface Components: High-speed transceivers and I/O expansion options
- Power Management ICs: Specialized power solutions for FPGA/SoC applications
- Development Accessories: JTAG programmers, debugging tools, and expansion modules
Learning Resources
- Training Courses: Official Xilinx training for hardware and software development
- Application Examples: Industry-specific implementation examples
- Technical Webinars: On-demand learning resources
- Community Forums: Knowledge sharing and problem-solving resources
5. Environmental & Export Classifications
Environmental Information
- Temperature Range: Industrial temperature grade (I) for operation in harsh environments
- RoHS Compliance: Meets RoHS requirements for environmental safety
- Lead-Free: Manufacturing processes conform to lead-free standards
- REACH Compliance: Meets European chemical regulation standards
Export Classifications
- ECCN: 5A002.A.4 (Export Control Classification Number)
- USHTS Code: 8542390001 (U.S. Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (EU Tariff Code)
- Export Regulations: Subject to specific export control regulations due to encryption capabilities
Quality Assurance
- Reliability Testing: Rigorous testing procedures for industrial-grade applications
- Quality Certifications: Manufactured under ISO-certified processes
- Warranty: Standard Xilinx warranty terms apply
- Traceability: Full component traceability for supply chain management
