吃瓜tv 路 Material selection & fabrication
Tg200 PCB: DSC, DMA & Material Specification
Make the 200掳C requirement unambiguous. Identify the measurement method and the actual resin system before comparing candidates or requesting a Tg200 board.
Send files for a material & fabrication quotePreliminary files welcome. Identify the grade, test method and unresolved requirements.
What does Tg200 PCB mean?
A Tg200 PCB requires a laminate glass transition around 200掳C under a specified test method. 鈥�200掳C by DMA鈥� and 鈥�200掳C by DSC鈥� are not automatically equivalent requirements, and neither means continuous service at 200掳C.
The main search and procurement problem at this grade is measurement equivalence. Different methods observe different physical responses. A material can carry more than one Tg value in the same datasheet without the document being contradictory.
For the complete grade map and temperature-test definitions, use the High Tg PCB material selection guide.
S1190 at 200掳C DMA vs IS415 at 200掳C DSC
Shengyi鈥檚 S1190 datasheet lists 170掳C by TMA and 200掳C by DMA. Isola鈥檚 IS415 datasheet lists 200掳C by DSC. If a drawing specifies 200掳C by DSC, the S1190 DMA figure does not by itself show compliance. Ask for the required method, acceptance basis and grade rather than comparing only the headline temperature.
There is no universal offset that converts DSC, DMA and TMA results for every resin system. Specimen preparation, cure history, procedure and reported transition feature must be understood. Retain the source document with the approved material release.
| Candidate / 吃瓜tv guide | Tg and method | Td, 5% mass loss | Z expansion, 50鈥�260掳C | Evidence |
|---|---|---|---|---|
| Shengyi S1190 | 200掳C 路 DMA (170掳C TMA) | 350掳颁 | 2.3% | |
| Isola IS415 | 200掳C 路 DSC | 370掳颁 | 2.8% | |
| Isola 370HR | 180掳C 路 DSC | 340掳颁 | 2.8% |
Typical published data, not purchase minima or a stock list. Methods, specimen construction and conditioning may differ. Confirm the supplier revision and the exact supplied construction. A missing entry is not zero.
Separate material Tg from a 200掳C operating environment
| What 200掳C means | Information needed |
|---|---|
| Material Tg | Manufacturer, grade, method, condition and minimum/typical requirement. |
| Board hot spot | Measured location, duration, power, cycles, atmosphere and required life. |
| Assembly peak | Complete time-temperature profile, passes, component limits and moisture handling. |
| A comparison target | Matching method and construction, plus expansion, Td, loss and other mandatory properties. |
An application that operates near 200掳C may need a broader material-system and product review than an ordinary high-Tg epoxy comparison. Components, solder joints, connectors, coatings and insulation all have their own limits. Discuss the complete duty cycle and qualification plan instead of applying a Tg-minus-fixed-margin rule.
Resolve the engineering question before choosing a grade
TG200 Engineering Workbench
Design and cost questions worth resolving early
For thick boards or inner heavy copper, review resin flow, copper balance and the hole construction together with the material. The heavy copper PCB guide addresses the copper geometry; the multilayer guide covers the stackup. Neither requirement can be selected from Tg alone.
If electrical loss matters, request Dk and Df at the relevant frequency and construction; do not infer low loss from a 200掳C transition. For cost, ask whether the exact grade and thickness are available and which alternative would require requalification. Compare against Tg180 candidates only when the actual requirements permit it; use rigid polyimide review when the resin system itself must change.
Prepare a Tg200 PCB fabrication enquiry
Enter the requested construction and material. The chosen grade remains a request until it is agreed for your build. You may skip the planner and send files directly. Material changes clear previously entered cost allowances.
TG200 Quotation Planner
Release requirements and evidence
Keep the approved laminate, compatible prepreg, supplier revision and permitted alternatives with the fabrication drawing. Add the finished stackup, copper, holes, finish, quantity and any assembly thermal profile. Specify the applicable bare-board standard/class/revision, electrical and construction checks, and additional thermal tests when required.
Review the quality and acceptance requirements and rigid manufacturing capability table for the actual construction. Supplier datasheet values are not a 吃瓜tv test report or a substitute for agreed inspection evidence. For populated samples, coordinate prototype assembly and validation with the same approved material.
Tg200 PCB questions
Is S1190 a Tg170 or Tg200 material?
The cited datasheet reports 170掳C by TMA and 200掳C by DMA. Both values must retain their method. Do not turn the DMA figure into an unreported DSC result.
Can DMA Tg200 satisfy a DSC Tg200 drawing note?
Not from that number alone. Obtain data using the specified method or an explicitly approved change to the requirement.
Is there a fixed formula to convert DSC to DMA Tg?
No universal conversion should be assumed. The measurement method, material and test procedure affect the reported value.
Can a Tg200 PCB run continuously at 200掳C?
Tg is not a continuous-use qualification. Define the actual duty and assess the material, finished board and assembled system against the required life and acceptance criteria.
Does Tg200 guarantee low loss?
No. Frequency-specific Dk/Df, foil and construction are independent selection inputs.
What should I send when the drawing only says Tg200?
Send the drawing and stackup, identify whether 200掳C is a material or service requirement, and state the required test method if known. Mark unresolved items for engineering review before fabrication.
Technical references
Manufacturer sources reviewed on 17 September 2026. Preserve the stated method and revision; confirm current data and supply before approving the build.
Send the material requirement with the board files
Attach fabrication/drill data, outline and stackup. State the thermal exposure, quantity, tests and required delivery date. If the grade or method is unresolved, mark it for engineering review. Downloaded tool notes must be attached manually.
Request a Tg200 PCB review