Description
Product Specification
The XCZU7CG-L2FFVC1156E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) designed by Xilinx (now AMD) for advanced embedded processing applications. This powerful FPGA combines an ARM Cortex-A53 processing system with programmable logic in a single device, making it ideal for applications requiring both software flexibility and hardware acceleration.
Key Features:
- System Logic Cells: 504,000 cells for extensive programmable logic
- CLB Flip-Flops: 460,800 for high-density sequential logic implementation
- Memory Resources: 11MB of embedded RAM
- Package Type: 1156-Pin FCBGA (FC: Flip Chip, BGA: Ball Grid Array)
- Speed Grade: L2 (Low-power grade 2) for reduced power consumption
- Temperature Grade: E (Extended temperature range)
- Technology: 20nm process technology
- Operating Voltage: Can operate at reduced VCCINT voltage (0.85V or 0.72V) for lower power consumption
- Processing System: Dual ARM Cortex-A53 processor cores
- Real-Time Processing: ARM Cortex-R5 processor for real-time applications
The “CG” variant focuses on cost-effectiveness while retaining essential processing capabilities, making it ideal for applications that need the system architecture without some of the specialized processing engines found in higher-end variants.
Price
The XCZU7CG-L2FFVC1156E is a premium FPGA component with pricing that varies based on quantity, market conditions, and purchasing channels. Current pricing typically ranges from $2,500 to $3,500 per unit for small quantities, with significant discounts available for volume purchases. For the most current pricing, request a quote directly from authorized Xilinx/AMD distributors.
Price factors that may affect this component:
- Global semiconductor supply chain conditions
- Order quantity (bulk discounts available)
- Lead time requirements
- Distributor markups
- Regional availability
Documents & Media
Technical Documentation:
- Product Datasheet: Comprehensive specifications and electrical characteristics
- Technical Reference Manual: Detailed architecture and functional descriptions
- Programming Guide: Instructions for FPGA configuration and software development
- Zynq UltraScale+ MPSoC Overview (DS891): Complete overview of device capabilities
- Package Device Pinout Files: ASCII and CSV format files detailing pin configurations
Development Resources:
- Vivado Design Suite: Integrated development environment for FPGA programming
- Vitis Unified Software Platform: Software development environment for ARM cores
- Application Notes: Implementation guidance for specific use cases
- User Guides: Step-by-step instructions for development and deployment
All documentation can be accessed through the AMD/Xilinx Technical Information Portal, with additional support available through official forums and technical support channels.
Related Resources
Development Boards & Evaluation Kits:
- SE120: PCIe card with FMC+ featuring XCZU7CG options
- PXIe800Z: PXIe card with FMC+ site supporting XCZU7CG configuration
- ZCU104: Evaluation platform compatible with Zynq UltraScale+ MPSoCs
Software Tools:
- Vivado Design Suite: Complete FPGA development environment
- Vitis AI: Development environment for AI inference on Xilinx devices
- PetaLinux Tools: Linux development environment for embedded applications
- System Optimizer: Power and performance optimization utilities
Compatible Components:
- FMC Mezzanine Cards: For I/O expansion and customization
- Memory Modules: Compatible DDR4 SODIMM modules
- Power Management Solutions: Reference designs for proper power sequencing
Community Resources:
- Xilinx/AMD Community Forums: User discussions and community support
- GitHub Repositories: Open-source reference designs and example projects
- Training Materials: Webinars, tutorials, and design examples
Environmental & Export Classifications
Environmental Specifications:
- Temperature Range: Extended commercial (E grade): -40°C to +100°C
- RoHS Compliance: Fully compliant with EU RoHS regulations
- Lead-Free Status: 100% lead-free packaging and connections
- Moisture Sensitivity Level (MSL): Level 3 at 260°C
Reliability Information:
- MTBF Rating: >100,000 hours at 55°C
- ESD Protection: 2000V Human Body Model (HBM)
- Latch-up Immunity: Tested per JESD78 standards
Export Control Classification:
- ECCN: 3A001.a.2.c (US Export Control Classification Number)
- HTS Code: 8542.31.0000 (Harmonized Tariff Schedule Code)
- CCATS: Available upon request for export compliance documentation
Packaging Information:
- Shipping Method: Tray packaging for production quantities
- Storage Requirements: Store in dry environment (<10% RH) at temperature <40°C
- Handling Precautions: ESD-safe handling procedures required
