³Ô¹Ïtv · RF materials & manufacturing
RO4003C vs RO3003 for RF PCB designs
Compare hydrocarbon ceramic and ceramic PTFE constructions without treating equal size as equal RF performance. Use the explanations, source documents and interactive calculations to make the next engineering decision with clear assumptions.
Bring your band, stackup, quantity and acceptance requirements. Preliminary files are welcome for review.
Start with the engineering decision
| Candidate | Process Dk | Design Dk | Typical Df reference |
|---|---|---|---|
| RO4003C | 3.38+/-0.05 | 3.55 | 0.0027 |
| RO3003 | 3.00+/-0.04 | 3.16 | 0.0010 |
Compare the intended constructions at the same thickness, foil, frequency and test boundary. The property references are not a claim that one material is always superior or interchangeable with another. A missing current value stays unresolved rather than becoming zero.
RF engineering workbench
Use explicit construction inputs. Results can be downloaded or opened as an email draft; the tool does not upload project information.
Worked planning example
Example: for model Dk 2.20, dielectric height 0.508 mm and target impedance 50 Ω, an ideal zero-thickness microstrip gives approximately 1.568 mm width and effective permittivity 1.881. At 10 GHz its guided wavelength is approximately 21.857 mm. These are illustrative model inputs, not properties assigned to every material discussed here.
Use the result to inspect scale and sensitivity. Preserve the input units and assumptions in the downloaded brief, then use the actual finished geometry and appropriate solver or measurement method for release.
Rogers Engineering Workbench
Compare constructions with an equal engineering question
A brand-to-brand comparison becomes useful when it names the exact candidate grades and the circuit they must serve. Each manufacturer may offer many resin systems, reinforcement styles, thicknesses and copper options. There is no single dielectric constant or loss tangent for a whole brand. Begin with the operating band, acceptable path loss, phase requirement, mechanical envelope and assembly exposure, then compare the constructions that could meet those needs.
Set a fair comparison boundary. If the goal is a direct material replacement, hold the geometry and thickness constant and calculate how impedance and phase would change. If rerouting is allowed, synthesize new dimensions for the same target impedance and compare the resulting space, tolerance and loss implications. Those are different studies. The material-change workbench shows both the resized width and the impedance of the unchanged original width so the distinction is visible.
Keep supplier measurement definitions attached to the values. Process Dk and design Dk may come from different methods, and Df values can be reported at different frequencies. Do not rank a table by the smallest number when the test conditions differ. Ask whether the available models and construction data are sufficient for the intended field solver and validation approach. Missing evidence is an open item, not a zero or an automatic failure.
Manufacturing compatibility affects the comparison. PTFE, thermoset RF and general-purpose glass-epoxy materials can require different hole preparation, bonding and handling. A material that looks attractive electrically may add a new process or qualification step. A familiar process may still require a different foil or thickness to reach the loss target. Include the full stackup and assembly in the decision, particularly for hybrids and metal-backed boards.
Compare the total change effort with the unit-board saving. A new material can require a layout revision, new coupon, fixture adjustment or another prototype round. Those one-time costs may be justified for a long production program and unnecessary for a short run. Record the engineering acceptance criteria and procurement restrictions before choosing the lowest quotation. The result should be a documented construction decision, not a generic winner assigned to an entire manufacturer.
From a nominal line to a toleranced RF layout
Establish the local cross-section before choosing a trace width. Record the dielectric height, material model, copper thickness and reference-plane arrangement. A total board thickness is not a valid substitute for the distance to the reference plane unless the structure is truly a two-layer core with that definition. For stripline, check whether the trace is centered and whether the dielectric is homogeneous on both sides.
Use a preliminary calculation to estimate scale, then evaluate the actual construction in a suitable solver. The ideal line model provides a reproducible starting point, but it does not include solder mask, trapezoidal etch shape, conductor roughness, dispersion or a three-dimensional connector launch. A calculator output with many decimal places is still only as useful as the assumptions that generated it.
Translate manufacturing variation into circuit questions. A width tolerance, dielectric-height tolerance and Dk variation do not necessarily combine as a single worst-case impedance number for every circuit. Establish which variables can move together and which are independently controlled. For a filter, sensitivity of resonator length and coupling gap may be more useful than one line-impedance estimate. For an array, phase tracking across paths can matter more than a nominal delay value.
Keep a continuous and intentional return structure. Slots, voids, antipads and layer changes can alter the fields even when the trace width remains constant. Where a signal transitions to another layer, review the return connection and launch geometry. Where a metal enclosure or shield is close to the line, include it in the final electromagnetic model. The schematic net name does not describe those physical boundaries.
Release a drawing that links the electrical model to measurable construction. Identify critical dimensions, stackup revision, allowed substitutions and the test method. If a prototype leads to a geometry adjustment, record the reason and the revised model rather than allowing the change to remain an undocumented fabrication compensation. That record makes later procurement and repeat production substantially easier to compare.
Cost planning and a direct RFQ route
Where the cost changes, and which savings are real
For a small RF order, setup, procurement and test preparation may matter as much as the area of laminate. A panel that holds more circuits spreads some shared effort across more boards, but only if the orientation, tooling and coupon requirements permit that layout. The budget tool uses an explicit rectangular nesting model so that its area assumption can be inspected. It does not assume every visible square millimeter of a panel becomes a delivered board.
Copper foil, core thickness and bonding system are part of the purchased construction. A quotation based on a different thickness or foil is not a clean price comparison, even when the headline material name matches. Ask whether the offered material is standard for the supplier's available construction and whether minimum purchases, special handling or qualification work affect the lot. Availability and lead time must be confirmed for the actual order rather than inferred from a web page.
Complexity can move cost in several directions. A hybrid stack may reduce the amount of premium RF laminate while adding press planning and interface review. Metal backing can improve a thermal path while adding bonding and machining requirements. Extra coupons or RF fixtures can reduce uncertainty but add material, setup and measurement work. Compare the complete project scope instead of ranking designs by laminate price alone.
The optional numerical budget uses cost allowances entered by the visitor. It contains no calibrated ³Ô¹Ïtv tariff and does not claim current market pricing. The model combines the costed panels, one-time setup, batch testing and per-board processing; assembly is included only when selected and entered. Shipping, taxes, process yield loss and unentered qualification are excluded. A zero value means already included or deliberately zero, not unknown.
When geometry, quantity or supply scope changes, revisit the allowances. A per-board processing cost from one batch may not apply to another. The tool clears old allowances on those changes to avoid presenting a stale total. Hybrid, metal-backed, unresolved and more complex multilayer constructions go to engineering quotation. The downloaded brief remains useful because it carries the requirements and assumptions even when a numerical price would be misleading.
Rogers Fabrication Budget & RFQ
Prefer to send files now? Contact the ³Ô¹Ïtv team with the requested material, construction and quantity. An exact quotation is based on the agreed scope.
Verify the construction that matters to the product
A measurement plan that answers the design question
Begin with what the prototype must establish. Is the question electrical continuity, line impedance, insertion loss, phase balance, resonant frequency, thermal behavior or mechanical fit? These are different tests and they may require different coupons, fixtures and acceptance limits. A test label without the represented structure and measurement method leaves room for two parties to interpret the result differently.
For RF measurements, define the reference planes and account for the launch or fixture. A raw network-analyzer trace can include connectors and transitions that are not part of the material comparison. De-embedding or a representative reference structure may be needed, depending on the question. Record calibration, frequency span, temperature and the circuit revision with the result. This makes later comparisons more informative than a single unqualified pass statement.
Investigate a disagreement between the model and the board in a controlled sequence. Check the finished conductor dimensions, dielectric height, material construction and measurement setup before changing the Dk to force a fit. The model may omit a nearby cover, a return-path discontinuity or a loss mechanism. Equally, the test fixture may represent a different structure from the intended coupon. Identifying the cause protects the next build from an accidental compensation.
Keep the accepted construction and records together. A successful prototype supports the tested revision under its stated conditions. Changes to material, foil, bond system, geometry, assembly exposure or test scope deserve review before a repeat order is treated as equivalent. The project does not need every possible test; it needs the evidence that resolves its actual risks and acceptance requirements.
Rogers Construction Explorer
Questions before the next design or purchase decision
What should this page help me decide?
Compare hydrocarbon ceramic and ceramic PTFE constructions without treating equal size as equal RF performance. Start with the named construction and the relevant engineering requirement. The photographs show physical circuit examples, while the original-source links and explicit model assumptions support the technical review.
Does the design tool approve this PCB for manufacture?
No. It calculates the stated preliminary model or organizes a construction brief. Finished copper, transitions, mixed dielectrics, assembly interfaces and process limits may require a more complete review. The downloaded result preserves assumptions so engineering can evaluate the same inputs.
Can I obtain a price without completing the tool?
Yes. Use the direct Contact or email route with your drawing, quantity and construction requirements. The optional budget uses your entered allowances and an explicit panel model; it is not a calibrated ³Ô¹Ïtv tariff. Complex constructions need a file-based quotation.
What should I send with an enquiry?
Include the exact material designation, fabrication artwork, drill data, outline, proposed stackup, copper, finish and quantity. Add the relevant impedance, RF, thermal or mechanical acceptance requirements. If assembly is included, provide the BOM, placement data and test expectations.
Continue with the right engineering task
Original technical references
Supplier documents support material identity, properties and methods. They do not establish current stock or qualify an unspecified finished board. Check the exact grade, construction and document revision for your order.