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Taconic RF-35TC PCB Material: Properties & Design

Combine dielectric loss planning with a defined heat path. Use the source context, engineering checks and project tools below to turn the material name into a usable fabrication specification.

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RF circuit photograph supplied for this Taconic update. The image shows conductor geometry; it does not certify a laminate grade or measured RF performance.
RF circuit photograph supplied for this Taconic update. The image shows conductor geometry; it does not certify a laminate grade or measured RF performance.

What to specify for RF-35TC

Taconic RF-35TC is covered here as a named RF material. TC, TC-A and HTC are different designations. Thermal conductivity depends on specimen and test conditions.

FieldSpecification context
Material identityRF-35TC
Reference Dk3.5
Reference Df0.002
Test contextDk/Df: 10 GHz modified stripline; k: C1/C1, 125簞C
Thermal conductivity0.92 W/m繚K; see specimen/test condition
Supply statusConfirm current grade, thickness, foil and order quantity; no stock promise

Do not miss: TC, TC-A and HTC are different designations. Thermal conductivity depends on specimen and test conditions.

Reference trail: 繚 繚 . Numerical values are typical material references, not purchase acceptance limits, live stock or guaranteed fabricated performance.

RF-35TC: Design the complete RF heat path
RF-35TC: Design the complete RF heat path. Conceptual engineering illustration.

Design the complete RF heat path

Dissipation in a trace or component creates heat, while thermal conductivity describes just one part of the heat-removal path. A laminate with higher conductivity may lower dielectric resistance, but interface material, copper area, vias and the enclosure can dominate the finished assembly. Evaluate thermal performance at the actual operating and ambient conditions.

  • Read the C1/C1 125簞C condition with the 0.92 W/m繚K figure
  • Include interface and heat-sink resistance
  • Review conductor heating and laminate loss separately
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Taconic PCB Design Workbench

Taconic RF Engineering
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Using this tool & sharing results

Use the stated units, input limits and model assumptions. Results support an engineering discussion; they do not approve a design, process or production order.

After changing inputs, update the result before using it. Where a download or copy action is available, review that brief and attach or paste it into your enquiry. Opening Contact does not transfer these inputs or send a request.

How to use and share tool results

The RF tool uses an editable model Dk; the preset is a supplier reference at its stated method and frequency. It is not a universal design Dk. Blank parameters stay blank until you provide a value. Geometry calculations do not approve a fabrication tolerance.

For microstrip, h is the dielectric separation to the reference plane; for symmetric stripline it is the total plane spacing. Propagation follows 弇g = c/(f���庰eff). Thermal screening uses R = h/(kA). Read the selected model���s exclusions beside the result.

For more geometries and fabrication tolerance context, use the PCB impedance calculator and design guide.

From material callout to fabricated PCB

01

Material release

Name RF-35TC, the supplier revision, thickness and foil. Separate approved substitutions from suggestions awaiting approval.

02

CAM and stackup

Review layer references, panelization, copper balance, minimum features and finished geometry. Read the C1/C1 125簞C condition with the 0.92 W/m繚K figure.

03

Process definition

Use the applicable laminate and bonding guides. Agree drilling, hole-wall treatment and lamination details for this construction; do not assume a universal FR-4 recipe.

04

Patterning and final build

Control conductor geometry, hole quality, mask openings and finish on exposed RF areas. Include special edges, cavities or connectors in the release.

05

Inspection and acceptance

Define dimensional, netlist and impedance checks. RF loss or phase measurements need a separate coupon/fixture, frequency range and acceptance limit.

Review the manufacturing capability tables for general process limits and quality documentation and acceptance planning for supplier review. A listed material property is not a 勛圖tv test report.

RF-35TC: material-to-build review
RF-35TC: material-to-build review. Conceptual engineering illustration.

RF-35TC PCB cost & quotation brief

A quote for RF-35TC depends on the approved material construction, purchased sheet utilization, quantity, layer count, drilling/lamination work, finish and inspection scope. There is no defensible fixed ���Taconic multiplier��� across these products. For older designations, sourcing confirmation may be the first cost decision.

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Taconic PCB Cost & Quotation Brief

Taconic RF Engineering
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Using this tool & sharing results

Budget outputs are planning scenarios. Check the included costs and rate assumptions; a confirmed quotation requires a review of your files and scope.

After changing inputs, update the result before using it. Where a download or copy action is available, review that brief and attach or paste it into your enquiry. Opening Contact does not transfer these inputs or send a request.

How to use and share tool results

Use the brief without prices, or enter your own setup and fabrication-area allowances to explore a simple two-layer planning range. The tool does not contain verified current supplier rates. Hybrid, multilayer, bonding-film and RF-qualified builds are routed to engineering quotation.

Cost questionInformation to provide
MaterialExact code, thickness, foil, substitutions allowed or prohibited
FabricationGerber/ODB++, drill data, stackup, copper, outline and special features
AcceptanceNet classes, impedance target/tolerance and any RF test fixture
OrderQuantity, requested delivery date, repeat-build needs and assembly scope

RF-35TC questions before ordering

What does the RF-35TC material name guarantee?

It identifies a material or family to resolve in the supplier documentation. The exact code, thickness, foil and data-sheet revision still need to be specified. It does not guarantee 勛圖tv stock, lead time or an application qualification.

Which Dk should I use in my RF model?

Dk/Df: 10 GHz modified stripline; k: C1/C1, 125簞C. Use a model Dk appropriate to your geometry and frequency. A process test value is useful reference data but is not automatically the effective permittivity of a microstrip.

Can I replace RF-35TC with another Taconic or Rogers grade?

TC, TC-A and HTC are different designations. Thermal conductivity depends on specimen and test conditions. Compare the complete electrical, mechanical and processing requirements, then approve the alternate explicitly.

What design detail deserves the first review?

Read the C1/C1 125簞C condition with the 0.92 W/m繚K figure. Use dissipated heat, not RF output power, as the thermal model input.

Does a netlist test verify RF performance?

No. Netlist testing checks connectivity. RF performance requires defined measurement structures, frequency range, reference planes and limits. State the required measurement in the RFQ.

How do I obtain a usable quotation?

Send the fabrication files, drill data, stackup, exact material code, quantity and acceptance requirements. Include your requested date; the delivery commitment depends on sourcing and process review.

Next useful references: Taconic PCB manufacturing 繚 full Taconic material directory 繚 Fabrication preparation for RF-35TC 繚 RF-35HTC 繚 RF-60TC.

Send the design with its material context

Preliminary files are welcome. Identify the design revision and open material decisions so the enquiry can address the actual manufacturing scope.

Send RF-35TC files for review