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Taconic TLP-5 PCB Material: Properties & Design

Source a legacy low-Dk PTFE/glass construction. Use the source context, engineering checks and project tools below to turn the material name into a usable fabrication specification.

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RF circuit photograph supplied for this Taconic update. The image shows conductor geometry; it does not certify a laminate grade or measured RF performance.
RF circuit photograph supplied for this Taconic update. The image shows conductor geometry; it does not certify a laminate grade or measured RF performance.

What to specify for TLP-5

Taconic TLP-5 is covered here as a historical or specialty material designation. TLP-5 and TLY-5 share nominal electrical figures in the archive but have different mechanical and cladding context.

FieldSpecification context
Material identityTLP-5
Reference Dk2.2
Reference Df0.0009
Test contextArchived Dk/Df: 10 GHz stripline resonator
Thermal conductivity0.22 W/m繚K; see specimen/test condition
Supply statusConfirm current grade, thickness, foil and order quantity; no stock promise

Do not miss: TLP-5 and TLY-5 share nominal electrical figures in the archive but have different mechanical and cladding context.

Historical provenance: the archived Taconic Laminate Material Guide used for this table. The historical values and stated test conditions are retained for identification; they are not current purchase limits. Verify the ordered grade against its original datasheet and certificate. For current product families and supplier document requests, consult the . That current guide does not independently verify every historical value above.

TLP-5: Woven reinforcement and the RF reference path
TLP-5: Woven reinforcement and the RF reference path. Conceptual engineering illustration.

Woven reinforcement and the RF reference path

Woven glass supports the PTFE structure, but the electrical path still depends on local geometry, foil and dielectric thickness. Keep the glass style, copper profile and source revision in the material callout. For precision phase matching, investigate routing orientation and length over the reinforcement rather than treating nominal Dk as a complete description.

  • Confirm current grade availability
  • Do not infer equivalence from Dk and Df alone
  • Retain the approved core and copper callout
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Taconic PCB Design Workbench

Taconic RF Engineering
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Using this tool & sharing results

Use the stated units, input limits and model assumptions. Results support an engineering discussion; they do not approve a design, process or production order.

After changing inputs, update the result before using it. Where a download or copy action is available, review that brief and attach or paste it into your enquiry. Opening Contact does not transfer these inputs or send a request.

How to use and share tool results

The RF tool uses an editable model Dk; the preset is a supplier reference at its stated method and frequency. It is not a universal design Dk. Blank parameters stay blank until you provide a value. Geometry calculations do not approve a fabrication tolerance.

For microstrip, h is the dielectric separation to the reference plane; for symmetric stripline it is the total plane spacing. Propagation follows 弇g = c/(f���庰eff). Thermal screening uses R = h/(kA). Read the selected model���s exclusions beside the result.

For more geometries and fabrication tolerance context, use the PCB impedance calculator and design guide.

From material callout to fabricated PCB

01

Material release

Name TLP-5, the supplier revision, thickness and foil. Separate approved substitutions from suggestions awaiting approval.

02

CAM and stackup

Review layer references, panelization, copper balance, minimum features and finished geometry. Confirm current grade availability.

03

Process definition

Use the applicable laminate and bonding guides. Agree drilling, hole-wall treatment and lamination details for this construction; do not assume a universal FR-4 recipe.

04

Patterning and final build

Control conductor geometry, hole quality, mask openings and finish on exposed RF areas. Include special edges, cavities or connectors in the release.

05

Inspection and acceptance

Define dimensional, netlist and impedance checks. RF loss or phase measurements need a separate coupon/fixture, frequency range and acceptance limit.

Review the manufacturing capability tables for general process limits and quality documentation and acceptance planning for supplier review. A listed material property is not a 勛圖tv test report.

TLP-5: material-to-build review
TLP-5: material-to-build review. Conceptual engineering illustration.

TLP-5 PCB cost & quotation brief

A quote for TLP-5 depends on the approved material construction, purchased sheet utilization, quantity, layer count, drilling/lamination work, finish and inspection scope. There is no defensible fixed ���Taconic multiplier��� across these products. For older designations, sourcing confirmation may be the first cost decision.

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Taconic PCB Cost & Quotation Brief

Taconic RF Engineering
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Using this tool & sharing results

Budget outputs are planning scenarios. Check the included costs and rate assumptions; a confirmed quotation requires a review of your files and scope.

After changing inputs, update the result before using it. Where a download or copy action is available, review that brief and attach or paste it into your enquiry. Opening Contact does not transfer these inputs or send a request.

How to use and share tool results

Use the brief without prices, or enter your own setup and fabrication-area allowances to explore a simple two-layer planning range. The tool does not contain verified current supplier rates. Hybrid, multilayer, bonding-film and RF-qualified builds are routed to engineering quotation.

Cost questionInformation to provide
MaterialExact code, thickness, foil, substitutions allowed or prohibited
FabricationGerber/ODB++, drill data, stackup, copper, outline and special features
AcceptanceNet classes, impedance target/tolerance and any RF test fixture
OrderQuantity, requested delivery date, repeat-build needs and assembly scope

TLP-5 questions before ordering

What does the TLP-5 material name guarantee?

It identifies a material or family to resolve in the supplier documentation. The exact code, thickness, foil and data-sheet revision still need to be specified. It does not guarantee 勛圖tv stock, lead time or an application qualification.

Which Dk should I use in my RF model?

Archived Dk/Df: 10 GHz stripline resonator. Use a model Dk appropriate to your geometry and frequency. A process test value is useful reference data but is not automatically the effective permittivity of a microstrip.

Can I replace TLP-5 with another Taconic or Rogers grade?

TLP-5 and TLY-5 share nominal electrical figures in the archive but have different mechanical and cladding context. Compare the complete electrical, mechanical and processing requirements, then approve the alternate explicitly.

What design detail deserves the first review?

Confirm current grade availability. Track the signal to its adjacent reference plane. A split or void can change the return path even if line width is correct.

Does a netlist test verify RF performance?

No. Netlist testing checks connectivity. RF performance requires defined measurement structures, frequency range, reference planes and limits. State the required measurement in the RFQ.

How do I obtain a usable quotation?

Send the fabrication files, drill data, stackup, exact material code, quantity and acceptance requirements. Include your requested date; the delivery commitment depends on sourcing and process review.

Next useful references: Taconic PCB manufacturing 繚 full Taconic material directory 繚 TLY-5 繚 TLY-3 繚 TLX-8.

Send the design with its material context

Preliminary files are welcome. Identify the design revision and open material decisions so the enquiry can address the actual manufacturing scope.

Send TLP-5 files for review