吃瓜tv 路 Material selection & fabrication
Tg180 PCB: Multilayer Design & Material Review
Specify a high-Tg epoxy system for the whole multilayer construction. Compare expansion and thermal endurance alongside copper distribution, plated holes and the assembly profile.
Send files for a material & fabrication quotePreliminary files welcome. Identify the grade, test method and unresolved requirements.
What does Tg180 PCB mean?
A Tg180 PCB uses a material requirement around 180掳C glass transition with a defined test method. Named high-Tg epoxy systems can support demanding multilayer designs, but Tg180 alone does not qualify a hole structure or an assembly process.
This page focuses on thickness-direction expansion and the production choices that accompany a multilayer board. When the concern is a plated hole or repeated heating, compare the full laminate system and a realistic process history rather than selecting only by a temperature label.
For the complete grade map and temperature-test definitions, use the High Tg PCB material selection guide.
Design choices that belong beside the material name
| Build choice | What to provide | Why it matters |
|---|---|---|
| Layer stack | Core/prepreg thicknesses, copper and finished thickness. | The laminate data need a defined construction. |
| Copper balance | Plane coverage, heavy copper regions and asymmetric features. | Resin flow and dimensional response are not defined by Tg alone. |
| Hole geometry | Finished holes, drill sizes, plating and any filled/blind structures. | Interconnect reliability needs a geometry and process review. |
| Thermal profile | Measured board temperature, passes, rework and moisture handling. | A short test result does not automatically cover the actual process. |
| Validation | Sample construction, thermal cycling/stress conditions and acceptance limits. | Evidence should be traceable to the board being qualified. |
Use the multilayer stackup planner for layer architecture and the HDI design guide for microvia constructions. These decisions remain separate from the Tg category.
370HR and S1000-2M: same DSC Tg, different data
Both cited supplier sources list Tg180掳C by DSC. Their published total Z expansion from 50鈥�260掳C is 2.8% for 370HR and 2.4% for S1000-2M. Shengyi also lists 185掳C by DMA. Preserve that method distinction and compare the actual construction, not just the catalogue row.
The values help frame a review but do not prove that one supplier grade is universally better. Copper, holes, resin content, moisture history and process control still matter. Review electrical properties at the design frequency if the board carries fast or RF signals.
| Candidate / 吃瓜tv guide | Tg and method | Td, 5% mass loss | Z expansion, 50鈥�260掳C | Evidence |
|---|---|---|---|---|
| Isola 370HR | 180掳C 路 DSC | 340掳颁 | 2.8% | |
| Shengyi S1000-2M | 180掳C 路 DSC (185掳C DMA) | 355掳颁 | 2.4% | |
| Isola FR406 | 170掳C 路 DSC | 300掳颁 | 3.5% |
Typical published data, not purchase minima or a stock list. Methods, specimen construction and conditioning may differ. Confirm the supplier revision and the exact supplied construction. A missing entry is not zero.
Resolve the engineering question before choosing a grade
TG180 Engineering Workbench
Glass Transition Explanation
Prepare a Tg180 PCB fabrication enquiry
Enter the requested construction and material. The chosen grade remains a request until it is agreed for your build. You may skip the planner and send files directly. Material changes clear previously entered cost allowances.
TG180 Quotation Planner
Agree inspection and cost around the real build
Request the material and stackup records, dimensional/electrical checks and any agreed cross sections or thermal coupons with the quotation. Define test conditions and pass criteria before comparing reports. A generic certificate or equipment photograph does not replace construction-specific evidence; use quality assurance planning to define the scope.
Higher layer count, special holes, unusual copper and additional tests can dominate the cost discussion. If changing from a Tg170 requirement or considering Tg200 material data, keep the permitted alternatives and test method explicit. Use the optional budget model only with allowances for the chosen construction.
Release requirements and evidence
Keep the approved laminate, compatible prepreg, supplier revision and permitted alternatives with the fabrication drawing. Add the finished stackup, copper, holes, finish, quantity and any assembly thermal profile. Specify the applicable bare-board standard/class/revision, electrical and construction checks, and additional thermal tests when required.
Review the quality and acceptance requirements and rigid manufacturing capability table for the actual construction. Supplier datasheet values are not a 吃瓜tv test report or a substitute for agreed inspection evidence. For populated samples, coordinate prototype assembly and validation with the same approved material.
Tg180 PCB questions
Are 370HR and S1000-2M both Tg180 by DSC?
Yes, the sources cited on this page report 180掳C by DSC. S1000-2M also has a separate 185掳C DMA value. Confirm the supplier revision and exact product before ordering.
Does lower Z expansion guarantee better via reliability?
No. It is one material parameter. Hole geometry, plating, resin construction, moisture, process and the required duty cycle must also be assessed.
Can I derive total expansion from DSC Tg and two CTE numbers?
Not reliably as a substitute for the published test. Different methods identify different transition features. This tool uses the supplier鈥檚 published total expansion over its stated interval instead.
Does Tg180 make a board a high-frequency laminate?
No. Design Dk, Df, copper roughness and construction need their own frequency-specific review.
Can the planner approve a multilayer stackup?
No. It organizes inputs and shows a dimensional illustration. Final stackup, processing and acceptance require engineering agreement.
What changes if assembly is included?
Add BOM, placement, component handling, measured thermal profile, rework allowance and test/firmware requirements. Fabrication material selection alone does not qualify the assembled product.
Technical references
Manufacturer sources reviewed on 17 September 2026. Preserve the stated method and revision; confirm current data and supply before approving the build.
Send the material requirement with the board files
Attach fabrication/drill data, outline and stackup. State the thermal exposure, quantity, tests and required delivery date. If the grade or method is unresolved, mark it for engineering review. Downloaded tool notes must be attached manually.
Request a Tg180 PCB review