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ITEQ IT-958G PCB: Dielectric Loss and Copper Choices
ITEQ IT-958G is a low-loss material whose electrical value should be evaluated in a defined construction. The useful design question is how much dielectric attenuation contributes to a real route and what remains outside that estimate. This page separates that calculation from a complete channel qualification.
Use the ITEQ material hub for family comparisons. Here the exact IT-958G callout, copper choice and method-qualified electrical inputs are the basis for an engineering inquiry.

Read the chart with its construction basis
The current ITEQ introduction lists Dk 3.7 and Df 0.0070 for IT-958G on the chart's 50% resin-content basis. Retain the corresponding technical document and frequency/method conditions. A headline pair is not a universal value for every core and prepreg construction.
The IT-170GRA2 guide owns a different material comparison. If both are candidates, request their proposed glass, resin and copper constructions rather than ranking them only by a single catalog number.
Material facts and decision boundaries
| Item | Source or model context | What it does not establish |
|---|---|---|
| Current chart | Dk 3.7 / Df 0.0070, RC 50% | Source-conditioned characterization. |
| Tool | Dielectric-only attenuation | No copper or transition loss. |
| Construction | Glass, copper and geometry | Compare like for like. |
Explain what dielectric loss leaves out
The worksheet uses a small-loss homogeneous TEM approximation from entered frequency, Dk, Df and path length. It estimates dielectric attenuation only. Conductor resistance, surface roughness, plating effects, vias and connectors are not included.
That boundary matters when a designer compares the result with a measured trace. A large difference does not necessarily invalidate the dielectric data; the measurement may include additional mechanisms and different reference planes. Keep the model and measurement boundaries explicit.
| Review item | What to establish |
|---|---|
| Material data | IT-958G source, frequency and construction. |
| Copper choice | Foil profile and final geometry retained. |
| Electrical boundary | Dielectric component separate from full channel. |
| Model limit | No conductor, via or connector attenuation. |
Homogeneous TEM dielectric loss illustration
Homogeneous TEM dielectric loss illustration
Use the current inputs and keep the assumptions
Start with the example only to inspect the units and the calculation boundary. Replace every assumption with a value tied to your own document or measurement. An empty numeric field is not zero. The review-reference field is a local label; avoid entering customer names, confidential part numbers or other private information into a public worksheet.
After calculating, read the notes alongside the numerical result. Changing any input invalidates the displayed result and disables its download until you calculate again. For a comparison, keep the units, geometry, material condition and measurement boundary consistent. A long decimal result does not imply equally precise input data. The downloadable record stays on your device and can be attached manually to an inquiry. It is not automatically transferred into the Contact form.
If an input is unknown, identify the person or document needed to resolve it. Do not fill a gap with a favorable generic value simply to obtain a result. You can request a material or fabrication review without using the tool. The arithmetic illustrates a relationship; it does not accept a construction, certify a material, establish current pricing or replace a supplier process specification.
| Input | What to establish before using it |
|---|---|
| Review reference | Nonconfidential revision label. |
| Frequency 繚 GHz | Single frequency; use Df/Dk for this frequency and method. |
| Relative permittivity | Homogeneous bulk permittivity, not an inferred microstrip effective value. |
| Loss tangent Df | Small-loss approximation; the model accepts less than 0.1. |
| Uniform path length 繚 mm | No connector, via or conductor-loss contribution. |
Optional cost comparison from your own allowances
Use a quotation or a clearly labeled internal assumption for each input. Keep the quantity, construction and inspection scope the same when comparing alternatives. This uncalibrated planning model adds entered values; it contains no current market rates and does not issue a 勛圖tv quotation. You can contact the team without completing it.
Optional project allowance comparison
Choose input data for the actual layer
Record glass style, resin content, dielectric separation, copper profile and the intended trace geometry. A material can produce different effective electrical behavior in different constructions. Do not use a process-control characterization value as a validated design Dk without checking its intended use.
If the required frequency lies outside the available data, identify that extrapolation as an assumption. A calculator can accept a number without validating it. Preserve the source and uncertainty rather than letting a precise-looking output imply more knowledge than the input supports.

Compare copper and dielectric improvements together
A lower-loss dielectric may reveal copper roughness as a larger part of the remaining attenuation. Changing copper can also affect adhesion, processing and available constructions. Review those tradeoffs with the fabricator and keep the exact proposed foil in the stackup.
For a lower-loss glass-system discussion, IT-988GSE provides a distinct page. Its historical identity must not be confused with current IT-988GLSE. A material-family upgrade is not a guaranteed interface improvement without a compatible full-channel analysis.
Protect legacy electrical requirements during substitution
An older IT-200LK design may contain delay or phase requirements that are not captured by a Df comparison. Recover the original model and decide which dimensions may change before proposing IT-958G as an alternative.
Keep impedance, attenuation and phase as separate review items. A geometry adjustment can recover one target while changing another. Agree how representative test structures or measurements will support the proposed construction.
Prepare a useful low-loss RFQ
Provide the IT-958G designation, operating band, critical routing, copper, layer structure, board dimensions and quantity. Identify the electrical source data and required testing. State any restrictions on material or foil substitutions.
The optional cost worksheet has no material-price feed. Use comparable quoted allowances and include any one-time electrical verification. The output can be attached manually, but it cannot approve the channel or promise stock. The final proposal needs the actual construction and acceptance boundary.
Tie the exact grade to an electrical construction
State the channel reference planes, frequency range, routing length, copper construction, transitions and interface assumptions together. A laminate loss-tangent value is one input to that system. It is not a complete insertion-loss measurement or a guarantee that a data rate will work.
Use comparable measurement or modeling conditions when screening alternatives. Material changes can require geometry changes to preserve impedance, and copper roughness can alter the result independently of the resin system. Keep the proposed stackup and the channel analysis synchronized through fabrication review.
For procurement, identify the properties that are fixed and the alternatives that can be evaluated. Request evidence at the relevant construction and frequency rather than a broad low-loss label. Compare total delivered scope and validation effort alongside material price. A shorter or better-routed channel may change the tradeoff more than replacing a material name alone.
A useful design-data record retains both the material value and the reason it was selected. State whether the value is supplier characterization, a construction-specific design input, a measured coupon extraction or an early assumption. These sources are not interchangeable. Keep frequency, method and specimen information visible when a comparison uses more than one document.
The tool on this page starts empty because a plausible default can otherwise be mistaken for a verified grade profile. Use the example to understand the units, then replace it with project inputs. A result with many decimal places does not imply that the material or routing-loss input is known to that precision.
For a high-speed design, plan how the model will be checked. Reference planes, coupon geometry, fixtures and the acceptance boundary determine what a measurement means. A coupon that characterizes one line construction does not automatically qualify every route or transition on the board.
Keep the commercial comparison aligned with the engineering one. Quantity, copper, layer structure, test deliverables and qualification effort should be comparable. A lower material allowance can be irrelevant if the proposed construction cannot meet the channel requirement, while a premium grade may be unnecessary if the actual route already has sufficient validated margin.
Standards, source context and limits
Use the edition, amendment and material-document revision named in the purchase agreement. A standards title, marketing label or supplier product family does not establish that a particular lot meets a requirement. Public summaries are useful for scope; the controlled specification and applicable test method govern acceptance.
The examples on this page are illustrative engineering scenarios. They are not 勛圖tv production records or guaranteed material values. Source links identify the organizations responsible for the referenced information. Confirm applicability to the exact grade, construction and test condition before carrying a number into a drawing or qualification report. Sources were reviewed on 3 October 2026. A public catalog search is not proof that an unlisted product never existed. Where the exact designation or current technical sheet could not be verified, this page provides a clarification workflow rather than an invented material specification. Current supply, construction availability and qualification remain separate questions.
For fabrication scope and the agreed construction requirements, see PCB manufacturing.