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Panasonic ECOOL R-1787: Glass-Composite Thermal PCB
Panasonic ECOOL R-1787 is a thermally conductive glass-composite circuit-board material. It is not an aluminium insulated metal substrate simply because heat dissipation is a prominent application. The reinforcement and the complete heat path remain part of the design.
This page addresses the thermal composite board. The Panasonic portfolio connects the surrounding materials, while bonding sheets and thermal films have their own construction tasks.
Identify the glass-composite route
The manufacturer product information identifies R-1787 and reports typical thermal conductivity of 1.10 W/(m繚K) by laser flash. The exact specimen and source still need to accompany the data used in a design.
The R-1786 guide covers a different CEM-3 construction and copper-resistance task. Do not assign R-1787 thermal properties to an ordinary R-1786 board or describe either glass-composite material as a metal-core stackup without evidence.
Construction decisions at a glance
| Review focus | Established context | Design boundary |
|---|---|---|
| Material form | ECOOL glass composite | Not aluminium IMS. |
| Typical conductivity | 1.10 W/(m繚K), laser flash | Source-specific characterization. |
| Heat model | One uniform layer | No junction-temperature prediction. |
Draw the complete cooling path
Identify the heat-producing component, copper spreading region, dielectric, mechanical interface and ultimate cooling surface. A board-level thermal property cannot alone determine component temperature, especially when the interface or enclosure limits heat removal.
Keep the heat-flow area explicit. The full board area may not be available to a small local source. Spreading, nonuniform copper and hot spots can make a one-dimensional estimate optimistic if its inputs are chosen without a physical basis.
| Review item | What to establish |
|---|---|
| Material | ECOOL R-1787 glass composite, not aluminium IMS |
| Heat path | Actual layer, local area and cooling interfaces |
| Electrical | Equipment insulation reviewed independently |
| Boundary | Layer resistance does not predict junction temperature |
Use the layer calculator to compare assumptions
The tool calculates resistance through one uniform layer and the associated temperature rise for entered heat flow. Its educational example uses 100 繕m, 1 W/(m繚K), 100 mm簡 and 2 W, yielding 1 K/W and 2 K.
Replace every example input with the relevant construction data before using it for a project discussion. The result excludes spreading, contact resistance, thermal vias, heat-sink behavior and ambient. It is not a prediction of LED junction temperature or product lifetime.
IMS dielectric thermal-resistance illustration
IMS dielectric thermal-resistance illustration
Use the current inputs and keep the assumptions
Start with the example only to inspect the units and the calculation boundary. Replace every assumption with a value tied to your own document or measurement. An empty numeric field is not zero. The review-reference field is a local label; avoid entering customer names, confidential part numbers or other private information into a public worksheet.
After calculating, read the notes alongside the numerical result. Changing any input invalidates the displayed result and disables its download until you calculate again. For a comparison, keep the units, geometry, material condition and measurement boundary consistent. A long decimal result does not imply equally precise input data. The downloadable record stays on your device and can be attached manually to an inquiry. It is not automatically transferred into the Contact form.
If an input is unknown, identify the person or document needed to resolve it. Do not fill a gap with a favorable generic value simply to obtain a result. You can request a material or fabrication review without using the tool. The arithmetic illustrates a relationship; it does not accept a construction, certify a material, establish current pricing or replace a supplier process specification.
| Input | What to establish before using it |
|---|---|
| Review reference | Nonconfidential revision label. |
| Dielectric thickness 繚 繕m | Actual insulating layer only, excluding copper and aluminium. |
| Through-thickness conductivity 繚 W/(m繚K) | Hypothetical value; replace with exact grade and method. |
| Uniform heat-flow area 繚 mm簡 | Ideal common area through the insulating layer; no spreading. |
| Heat through this layer 繚 W | Allocated steady heat flow, not total electrical input power. |
Optional cost comparison from your own allowances
Use a quotation or a clearly labeled internal assumption for each input. Keep the quantity, construction and inspection scope the same when comparing alternatives. This uncalibrated planning model adds entered values; it contains no current market rates and does not issue a 勛圖tv quotation. You can contact the team without completing it.
Optional project allowance comparison
Keep electrical insulation independent
The material information also includes electrical test results. A dielectric-breakdown field or tracking result is not the permitted working voltage of the finished assembly. Board edges, conductor spacing, contamination and the equipment requirement remain important.
Describe the actual applied bias and insulation geometry in the review. Reducing dielectric thickness to lower thermal resistance may create a different electrical and mechanical problem. A positive thermal calculation cannot approve that tradeoff.
Compare additional thermal layers by their role
The R-14T1 bonding-sheet guide deals with a separate heat-conducting bond interval. The R-2400 film guide addresses filling and multilayer construction. Neither is simply another name for an R-1787 core.
If a proposed stackup combines them, request the actual process and qualification approach. Supplied thickness, final bondline, copper topography and local insulation requirements should be reviewed together rather than inferred from individual catalog conductivities.
Send a thermal and mechanical inquiry
Provide the exact R-1787 callout, board dimensions, copper, thickness, heat sources, cooling interfaces, quantity and assembly history. Include the insulation requirement and requested inspection evidence. Identify what is fixed by the product enclosure.
The optional allowance tool contains no thermal-material market database. Compare entered quotes with the same fabrication, interface and verification scope. 勛圖tv can review the material and heat-path question directly without a completed calculator or a claim that the raw-material conductivity guarantees the finished result.
Keep reinforcement architecture and exact grade distinct
The finished board combines a dielectric, copper patterns, holes, surface coatings and a manufacturing history. Its behavior cannot be inferred from a family name alone. State the supplied grade, reinforcement, thickness, copper and processing conditions that matter to the intended application.
Keep handling and assembly requirements with the fabrication drawing. A thin panel, punched outline or unusual support condition can change the production route even when the electrical circuit is simple. Ask the fabricator to review the actual features and panel format rather than assuming a dimensional example represents a production capability.
For cost comparison, hold the drawing, quantity, test scope and acceptance requirements constant. Record one-time tooling separately from recurring work, and distinguish raw material utilization from accepted-board yield. Any calculator on this page uses supplied assumptions; an actual quotation requires the files and an agreed scope.
CEM family names describe broad composite constructions, not a universal property table. CEM-1 and CEM-3 use different core reinforcement arrangements, and individual grades can differ in chemistry, thermal behavior and process guidance. Obtain the exact product source before assigning numerical design values.
Panel planning and mass estimation are useful only when their boundaries are explicit. A rectangular nesting result does not include every tooling or process constraint. A dielectric-plus-copper mass subtotal does not include coatings, plated barrels or components. Use the model to expose assumptions, then obtain the information needed for the actual production proposal.
Chemical declarations should also follow the exact grade. A broad reinforcement category cannot establish halogen composition or satisfy every restricted-substance requirement. Preserve the product, declaration scope and applicable customer criterion. Thermal assembly compatibility remains another question even when the chemistry requirement is resolved.
If a legacy product number is unverified, ask for the original source or a written supplier mapping. A current catalog product may be considered as an alternative, but its data must not be relabeled as the old grade. Record the replacement decision and any required engineering or customer approval before updating the manufacturing specification.
Standards, source context and limits
Use the edition, amendment and material-document revision named in the purchase agreement. A standards title, marketing label or supplier product family does not establish that a particular lot meets a requirement. Public summaries are useful for scope; the controlled specification and applicable test method govern acceptance.
The examples on this page are illustrative engineering scenarios. They are not 勛圖tv production records or guaranteed material values. Source links identify the organizations responsible for the referenced information. Confirm applicability to the exact grade, construction and test condition before carrying a number into a drawing or qualification report. Sources were reviewed on 3 October 2026. A public catalog search is not proof that an unlisted product never existed. Where the exact designation or current technical sheet could not be verified, this page provides a clarification workflow rather than an invented material specification. Current supply, construction availability and qualification remain separate questions.
