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Panasonic R-14T1 Bonding Sheet: Heat-Path Planning
Panasonic R-14T1 is a thermally conductive bonding-sheet material. It belongs in the heat-path and bondline discussion, not in a generic table of cured core properties. Its final thickness and contact geometry determine how useful the thermal material is in the assembled construction.
This page focuses on the bond interval and its assumptions. The Panasonic material hub supplies the wider portfolio, with film filling and complete composite-board materials treated separately.
Keep old and new names traceable
The current manufacturer page lists R-14TY as a new designation alongside existing R-14T1. It notes that recognition details may differ between new and existing products. A procurement response should state the exact offered name rather than silently replacing the drawing callout.
Panasonic reports typical conductivity of 1.4 W/(m繚K) with a laser-flash method. Its specimen context does not establish every final bondline or equipment temperature. Keep the applicable sheet and the supplied construction with the design record.
Construction decisions at a glance
| Review focus | Established context | Design boundary |
|---|---|---|
| Names | R-14T1 and new R-14TY | Recognition mapping needs confirmation. |
| Typical conductivity | 1.4 W/(m繚K), laser flash | Actual bondline still required. |
| Model | Uniform layer resistance | Interfaces and spreading excluded. |
Draw the actual bond interval
Identify the two surfaces being bonded, their copper topography, contact area and required final separation. The nominal supplied sheet thickness and the final local dielectric interval are not necessarily the same quantity.
Ask how the proposed process controls filling and residual insulation in dense and sparse copper regions. The R-2400 film guide provides a separate volume discussion, but its film behavior must not be assumed to describe R-14T1 sheet processing.
| Review item | What to establish |
|---|---|
| Mapping | R-14T1 and proposed R-14TY identity retained |
| Bondline | Final local interval and copper topography |
| Heat | Uniform layer model with interfaces excluded |
| Boundary | No working voltage, cure recipe or durability approval |
Evaluate one-dimensional resistance
The worksheet uses layer thickness, through-thickness conductivity and uniform heat-flow area. It then calculates the temperature rise across that layer for an entered heat flow. The sample values of 100 繕m, 1 W/(m繚K), 100 mm簡 and 2 W produce 1 K/W and 2 K.
These are educational assumptions, not an R-14T1 preset. The model excludes spreading, contact resistance and the surrounding cooling system. It cannot predict the temperature of a component or tell the designer how much bond pressure or cure time to use.
IMS dielectric thermal-resistance illustration
IMS dielectric thermal-resistance illustration
Use the current inputs and keep the assumptions
Start with the example only to inspect the units and the calculation boundary. Replace every assumption with a value tied to your own document or measurement. An empty numeric field is not zero. The review-reference field is a local label; avoid entering customer names, confidential part numbers or other private information into a public worksheet.
After calculating, read the notes alongside the numerical result. Changing any input invalidates the displayed result and disables its download until you calculate again. For a comparison, keep the units, geometry, material condition and measurement boundary consistent. A long decimal result does not imply equally precise input data. The downloadable record stays on your device and can be attached manually to an inquiry. It is not automatically transferred into the Contact form.
If an input is unknown, identify the person or document needed to resolve it. Do not fill a gap with a favorable generic value simply to obtain a result. You can request a material or fabrication review without using the tool. The arithmetic illustrates a relationship; it does not accept a construction, certify a material, establish current pricing or replace a supplier process specification.
| Input | What to establish before using it |
|---|---|
| Review reference | Nonconfidential revision label. |
| Dielectric thickness 繚 繕m | Actual insulating layer only, excluding copper and aluminium. |
| Through-thickness conductivity 繚 W/(m繚K) | Hypothetical value; replace with exact grade and method. |
| Uniform heat-flow area 繚 mm簡 | Ideal common area through the insulating layer; no spreading. |
| Heat through this layer 繚 W | Allocated steady heat flow, not total electrical input power. |
Optional cost comparison from your own allowances
Use a quotation or a clearly labeled internal assumption for each input. Keep the quantity, construction and inspection scope the same when comparing alternatives. This uncalibrated planning model adds entered values; it contains no current market rates and does not issue a 勛圖tv quotation. You can contact the team without completing it.
Optional project allowance comparison
Consider the material on either side
The ECOOL R-1787 guide addresses a thermal glass-composite board, while the R-1786 page addresses a different CEM-3 copper path. Their individual properties do not alone define the thermal resistance of a bonded assembly.
Record all layers, interfaces and heat-sink assumptions. A better bonding-sheet conductivity may have little effect when a separate mechanical interface dominates the resistance. Compare the complete design boundary before paying for a material change.
Keep insulation and mechanics in the review
Thinner bondlines can alter electrical separation and sensitivity to local defects. Catalog tracking data do not approve an equipment working voltage. Identify the conductor geometry, applied bias, environment and required insulation evidence.
Mechanical fit, flatness and mounting loads may also affect the final assembly. The thermal worksheet does not predict warpage or bond durability. Include those requirements in the drawing and acceptance plan rather than expecting the material name to imply them.
Prepare a focused bonding inquiry
Send the exact R-14T1 or proposed R-14TY designation, source revision, mating-layer construction, copper pattern, target final interval, board dimensions and quantity. Include heat-flow and insulation requirements and the actual assembly history.
Use the optional allowance tool for comparable quote figures, including any required process development and verification. It does not establish stock, current price or a qualified bonding recipe. 勛圖tv can review the actual construction question directly, with the worksheet attached manually if useful.
Review supplied form, local geometry and process together
A stackup is an agreement about physical construction, not just a vertical list of copper layers. Give each dielectric interval an identity and distinguish cured core thickness from the pressed thickness of bonding material. State whether copper is included in every quoted dimension.
Review the implications of a material change across impedance, lamination, drilling, registration and assembly exposure. A replacement with a similar headline Tg or Dk can still require a different geometry or process. Preserve the approved layer order, copper distribution assumptions and measurement basis with the manufacturing files.
Use the worksheet to organize a review, then obtain the fabricator's proposed construction and tolerances. Close differences before release. The final stackup, drawing and procurement material list should reference the same revision, especially when multiple suppliers or repeat orders are involved.
Bonding materials cannot be selected from a cured-laminate table alone. Establish whether the product is woven-glass prepreg, another reinforced bonding system or resin-coated copper. Each form has a different relationship between its supplied condition and the finished dielectric interval. Preserve the exact product and source revision in the proposed build.
Local copper distribution matters. Average coverage can conceal a large clearance region, a thick copper transition or a difficult target area. Supply the actual artwork and identify the locations that drive filling, registration or opening requirements. A single global thickness or aspect ratio does not characterize every local feature.
Process guidance should be applied by the responsible manufacturing team to the actual construction. A public document does not replace press-load qualification, handling controls or an approved drilling and metallization route. Do not use a generic bake or cure instruction for an unidentified bonding material.
Agree how the critical features will be verified. Representative cross-sections, dimensions and appropriate electrical or reliability evidence answer different questions. Keep the selected locations and acceptance requirements with the drawing so that a successful easy region is not mistaken for evidence about the most demanding feature.
Standards, source context and limits
Use the edition, amendment and material-document revision named in the purchase agreement. A standards title, marketing label or supplier product family does not establish that a particular lot meets a requirement. Public summaries are useful for scope; the controlled specification and applicable test method govern acceptance.
The examples on this page are illustrative engineering scenarios. They are not 勛圖tv production records or guaranteed material values. Source links identify the organizations responsible for the referenced information. Confirm applicability to the exact grade, construction and test condition before carrying a number into a drawing or qualification report. Sources were reviewed on 3 October 2026. A public catalog search is not proof that an unlisted product never existed. Where the exact designation or current technical sheet could not be verified, this page provides a clarification workflow rather than an invented material specification. Current supply, construction availability and qualification remain separate questions.
